CaDCaM’s capabilities in the field
- Thermal control design and implementation of these principles in the products
- Thermal control – active / passive systems, PCB’s and electronic components
- Measurement and verification of the control design
Using TEC and Heating blankets. - ON-OFF control
- PID control
- PD control
In thermal control analysis CaDCaM is using the following tools
- TEC
- HEATERS
- CONTROLERS
Mechanical Design
One of the most prominent areas in CaDCaM is Electronic Packaging. Electronic Packaging is an integral part of each development process of electronic devices. Packaging design is the stage where it is determined how and where each part is placed in the product, functionality wise and visual look is also being taken under consideration.CaDCaM specializes in electronic packaging and is a leading provider in the industry with a team of skilled and experienced engineers in the field.
CADENCE\NUMECA
NUMECA software provides premium solutions for flow analysis in the fields of aeronautics, marine industry, process industry and wind engineering.
The software provides advanced networking options and performs three-dimensional automated optimizations of turbo components, machines, aircraft
and air munitions using an artificial neural network and genetic algorithms to design the blade profile
MIDAS NFX
MIDAS IT is represented in Israel by CaDCaM which provides sales services, support and training.MIDAS NFX is a powerful, general purpose Finite Element Analysis (FEA) tool with an integrated graphical user interface (GUI) and model Editor which is used to analyze linear and nonlinear stress, dynamics, and heat transfer characteristics of structures and mechanical components. It represents the latest in FEA technology with some of the fastest solvers on the market along with accurate solutions that have been trusted for nearly 20 years by companies in all industries. MIDAS NFX is available on a wide variety of platforms including 32-bit and 64-bit Windows and Linux operating systems.
