One of the most prominent areas in the company is electronic packaging.
Electronic packaging is an integral part of each development process of electronic device.
Packaging design is the stage where it is determined how and where each part is placed in the product/system.
CaDCaM specializes in electronic packaging and is a leading provider in the industry with a team of skilled and experienced engineers in the field. Our team understands the importance of electronic packaging in the development process as a whole and knows how to take into account the product definitions, functionality wise, and differences between the flexible packaging and rigid packaging.
CaDCaM provides Electronic Packaging services to
Civilian market
Defense market
The Medical market
High-Tech industry
Telecommunication market
Research and science (academy)
Our capabilities in the field
- PCB’s Layout Design
- Components Placement design
- Restrictive course design
- Choosing Connectors
- Choosing heat – sink
- Combining and selecting thermal pads for heat conduction
- Sealed /unsealed boxes design
- Setting materials, coatings and paints
- Motherboards design
- Design to meet the standards of EMI & RFI
- Design to meet safety standards
- Design to meet vibration
- Design to meet shock
Stress Analyses
Stress analyses gives tensile resistance of the material, pressing, cutting, twisting and bending stress. Strength analysis examines the adjustment of a structure (or a machine part) and materials of which it is composed. Understanding the material’s strength and the load acting on it allows the engineer to select a suitable material or part of the machine and adjust the necessary measurements to be able to carry it safely, but also efficiently and economically. Strength of materials deals with the relationship between stress and distort in terms of planning stress as allowed, permitted movements and safety factors.
CaDCaM also performs structure analyses by finite element method FEM using the most advanced and internationally recognized S/W – NEI NASTRAN.
Static analyses – IMPLICIT – are characterized by relatively small movements.
Dynamic analyses – EXPLICIT – characterized by large movements and deformations – collisions, explosions, etc.
Thermal Analyses
CaDCaM specializes in thermal analyses, flow analyses, flow analyses combined with heat transfer and thermal control analyses.
CaDCaM performs heat transfer analyses and flow analysis for the military and civilian market. Analyses are performed in the field of electronic equipment, aerospace, air-conditioning, heavy duty industry, optics and medical equipment.
CaDCaM performs heat transfer analyses and flow analysis in the most advanced methods in the world – FEM (Finite Element Analysis) and CFD method.
CaDCaM uses world leading software tools for solving such problems and at the same time set as a vision to keep the customer as an integrated partner throughout the process / solution.
